As I said before, my fears have been confirmed. The aerodynamics are the worst. The design of the fan is extremely bad - there will be mixing of air masses.
The joints that I see:
1)One heat pipe. Well Apple, is it so difficult to learn the laws of physics and design features. The diameter of the heat pipe is too small, there is no reserve for effective heat dissipation. The chip itself will be trotting, but also the memory. Two heat pipes, because they work independently and more efficiently. Normal cooling systems use at least 2 heat pipes - one between “chip heat sink and heatsink”, and the second between “memory heat sink - heatsink”. RAM memory hates overheating. And here is a common substrate.
2)The cooling radiator is a crescent moon. Uh, okay. A shape is a shape. Why is the effective area reduced!? For the sake of design!? It doesn't fit!? Why cut and rounded. The cooling efficiency is also reduced on the sides compared to the center, by 15-20 percent. Another disadvantage. You could have narrowed the fan housing and made it tulip-shaped. Judging by the space between the motherboard and the cooler case it was possible to install a larger fan by area. Apparently, they are just lazy to release a new type of fan - why, shove the same fan wherever you can - maybe it will cool, and maybe not.
3)NAND module has no cooling at all.
4)Repairability I estimate at 7 points out of 10.